顾问委员会 Chair: Hamid AzimiCorporate VP, Director of Substrate Packaging TD IntelDeputy Chair: Markus KeilVP Global Semiconductor Operations/COO NextlensVincent DiCaprioVP Advanced Packaging and ICAPS / Head of Business and Corporate Development AMATJennifer ZhaoGM & EVP for Advanced Optical Sensors Division amsDr. Xiaoxin QiuCEO Axera TechnologyMartin WeigertVP & GM Industrial Fiber Products Division BroadcomAmy LeongCMO FormfactorFarhat JahangirCo-founder & CEO GS MicroelectronicsVance WangFormerly VP New Fab Project at GTAChang FuAdvanced Module R&D Dep., Deputy DirectorHLMCProf. Shaojun WeiProfessor IME, Tsinghua UniversityYaojian LinVP, GM of Technology R&D CenterJCET GroupJingyang ZhangChairman and CEOMooreEliteDr. Naveed SherwaniChairman / Chairman & CEOOSFPGA Foundation / Rapid SiliconDr. Tim YehTechnical Director of Power BUSanan ICAndrew PengIn Transition Formerly VP of Spin TransferJoseph ChouGMSuzhou Semitop Semiconductor Co LtdYC LeeCEO TRS ChinaWei WangAsst. President, Director of Strategy DevelopmentAutomotive Research Institute (Suzhou), Tsinghua University (TSARI)Weihua ChengCOOYMTCSantosh KumarDirector & Principal AnalystYole DéveloppementDr. Wei LiChairman / EVP Zing Semiconductor / National Silicon Industry Group