顾问委员会

Chair: Hamid Azimi
Corporate VP, Director of Substrate Packaging TD
Intel

Deputy Chair: Markus Keil
VP Global Semiconductor Operations/COO
Nextlens

Vincent DiCaprio
VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
AMAT

Jennifer Zhao
GM & EVP for Advanced Optical Sensors Division
ams

Dr. Xiaoxin Qiu
CEO
Axera Technology

Martin Weigert
VP & GM Industrial Fiber Products Division
Broadcom

Amy Leong
CMO
Formfactor

Farhat Jahangir
Co-founder & CEO
GS Microelectronics

Vance Wang
Formerly VP New Fab Project at GTA

Chang Fu
Advanced Module R&D Dep., Deputy Director
HLMC

Prof. Shaojun Wei
Professor
IME, Tsinghua University

Yaojian Lin
VP, GM of Technology R&D Center
JCET Group

Jingyang Zhang
Chairman and CEO
MooreElite

Dr. Naveed Sherwani
Chairman / Chairman & CEO
OSFPGA Foundation / Rapid Silicon

Dr. Tim Yeh
Technical Director of Power BU
Sanan IC

Andrew Peng
In Transition
Formerly VP of Spin Transfer

Joseph Chou
GM
Suzhou Semitop Semiconductor Co Ltd

YC Lee
CEO
TRS China

Wei Wang
Asst. President, Director of Strategy Development
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)

Weihua Cheng
COO
YMTC

Santosh Kumar
Director & Principal Analyst
Yole Développement

Dr. Wei Li
Chairman / EVP
Zing Semiconductor / National Silicon Industry Group