Stanley Chen photo
2022 Speaker

Stanley Chen

  • Shenzhen CVA Innovation Co Ltd
  • CEO
  • Biography

Stanley Chen is the founder and CEO of CVA Innovation since 2018. CVA Innovation is a fabless IC design company, designing sensors and edge computing SoCs for automotive, mobile phone and IoT markets. CVA’s domain expertise includes human-machine interface (HMI), mixed signal design, and complex SoC (System-On-Chip). Current product portfolio includes MCU, proximity sensor, capacitive touch sensor, pressure sensor, and smart scaler chips.

Stanley Chen has experience in consulting and equity investment for nearly 20 years. He took the lead and participated in over 40 equity investment deals in the field of technology, industry, resource and energy. During early years of his career, he founded two high-tech companies in the field of Internet and enterprise software.

He graduated with a MBA degree from UCLA Anderson School of Management, and bachelor degrees of automobile engineering, law, and computer science from Tsinghua University. He was rated top 1 in college entrance exam of science in Guangxi province in 1993, also won the first prize in National College Students’ Entrepreneurship Competition in 1998.

He was born in Liuzhou, Guangxi, and now lives in Shenzhen. Stanley Chen is council member of Tsinghua Alumni Association Hong Kong and Tsinghua Alumni Association of Automotive Industry, a member of Tsinghua Entrepreneur & Executive Club(TEEC), and the president of Guangxi Liuzhou High School Alumni.

  • Presentation

Topic TBC

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Shenzhen CVA Chip logo
  • Company Profile

Shenzhen CVA Innovation Co Ltd

CVA Innovation is a fabless semiconductor company designing sensors and edge computing chips for mobile phone, IoT and automotive markets. CVA’s domain expertise includes human-machine interface (HMI), mixed signal design, and complex SOC (System-On-Chip). Current product portfolio includes proximity sensor, capacitive touch sensor, pressure sensor, smart scaler chips, and auto MCU.

The company was founded in 2018, with head quarter in Shenzhen and R&D centers in Shanghai and Beijing, and was certified as a National High Tech Company in 2020. Core team members of the company are all from renowned companies, with full capacity in IC design, software, firmware, algorithm, and system design areas. The team has well proven track record, designed dozens of chips with sales volume over one billion units. We are also very proud of our innovation capability, proven by world class innovation recognitions such as CES design award, Edison Award and MWC awards.

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