Dr. David Haynes
David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications.
In his professional career, David has accrued more than 20 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors with STS, SPTS and Oxford Instruments. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies.
Building on this technical knowledge, David has a proven track record in developing strategic business partnerships; specialising in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide.
David Joined Lam Research in June 2016 and is currently Managing Director of Strategic Marketing in Lam’s Customer Support Business Group.
Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems
As technology node scaling becomes increasingly complex and expensive, an increasing number of semiconductor manufacturers and foundries are turning to the development of specialty technologies and advanced packing solutions to deliver increased system functionality and performance whilst managing development costs.
Specialty technologies such as sensors (MEMS, CIS and IR Sensors), RF Devices, optoelectronics, advanced power semiconductors (MOSFETs and IGBTs), and Bipolar-CMOS-DMOS (BCD) power management ICs are key to enabling applications in consumer electronics, automotive electronics, IoT applications and cellular communications; including 5G. This trend means that by 2023 these specialty technologies will account for approximately 30% of all global IC demand1.
At the same time, this high cost of scaling single chip solutions is also driving development of heterogeneous chip integration using advanced packaging. These heterogenous integration schemes are focussed on bringing together multiple chips and functions in a single package. While conceptually very similar to multi-chip modules, recent developments deploy a strategy of using advanced wafer manufacturing technologies to meet the ever-increasing performance and form factor requirements.
This presentation will talk about the trends in specialty technologies and heterogenous integration through advanced packaging as well as how the technical challenges associated with these applications can be addressed by high volume CMOS manufacturing solutions.
1 IC Insights, McClean Mid-Year Forecast, July 2021 & OSD Report, March 2021
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