Dr. Key Chung
C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 40 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.
Various Advanced Packaging Solutions and its Trends
Advanced packaging is developed for high performing computing, that need higher power of computation and memory bandwidth. As the cost per transistor is getting higher and scaling is slowing down, chip partitions are being applied, and advanced packaging is developed to integrate these chiplets homogeneously or heterogeneously. TSMC launched its CoWoS and InFO in earlier 2010s, since then the advanced packaging has been grown up significantly. Intel has its EMIB, Co-EMIB, Foveros and Foveros Omni; comparatively AMD also developed 2.5D, HDCL, FanOut and Cubic package; Samsung’s HBM is a 3D package, they have 2.5D package and closely developed Panel Fan-Out. SPIL has been manufacturing 2.5D, FanOut, FOPoP and FOEB for a while. Similarly, ASE has developed its FoCoS, FOPoP, FOEB, Panel FO and 2.5D. Its FoCoS has been high volume manufactured. Amkor lately publishing the S-connect, and FOHD. PTI and UMTC are immensely developing panel FanOut. Then
JCET has shipped out eWLB (FOSD) for some year, lately certified its FOMCM, and started manufacturing. Similarly to TFME, which is setting up its 2.5D line and its FOPoS has been certified and start manufacturing. In this presentation, various form of advanced packaging with its similarity in term of form factors and challenges are presented. The trends of these advanced packaging are then shared.
TongFu Microelectronics Co., Ltd
Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu Microelectronics specializes in integrated circuit packaging and testing. Nantong Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu), Suzhou Tongfu Super Micro Semiconductor Co., Ltd. (TF-AMD Suzhou), TF AMD Microelectronics (Penang) Sdn. Bhd. (TF-AMD Penang) six major production bases. Through its own development and acquisitions, the company has become a local semiconductor multinational group company, China’s integrated circuit packaging and testing leader, the total number of employees of the group is more than 13,000 .
As a key undertaking unit of the National Major Science and Technology Projects (” 02 “Project), Tongfu Micro-Power has a state-recognized enterprise technology center, national post-doctoral research station, Jiangsu Provincial Engineering Technology Research Center and Advanced Information Technology Research Institute and other high-level research and development platforms, with a technical management team of more than 2000 people .
Tongfu Microelectronics is the first company in the industry to pass ISO9001, ISO/TS16949 and other quality systems. Adopt SAP, MES, equipment automation, EDI and other information systems, which can automatically control the production process according to the personalized specifications of customers, and carry out real-time information exchange with customers. Implement the “Tongfu Micro-electric Industry 4.0” project, comprehensively build a smart factory based on the Internet of Things, establish a flexible automated assembly line, and achieve a win-win situation with customers .
The development goal of Tongfu Microelectronics is to become a world-class integrated circuit sealing and testing enterprise. With the support of national policy and market, the demand of system manufacturers, the coordinated development of industrial chain, and the support of national industry fund and national major projects, Tongfu Micro will continue to march toward the goal of the world-class integrated circuit sealing and testing enterprise .