Agenda – CISES 2021

12-13 October 2021 | Shanghai, China

12 Oct 2021 (Day 1)

Theme: Solidifying the Collaboration of the Semiconductor Supply Chain for the Success of 5G, IoT, AI, AR/VR and Automotive Electronics
07:45 – 08:15

Registration

08:20 – 08:25

Opening Ceremony

08:30 – 08:40

Welcome Address

08:45 – 09:05

Opening Address reserved for Shanghai Government

Prof. Shaojun Wei
09:10 – 09:30

KEYNOTE: Tsinghua University, IME

  • Prof. Shaojun Wei
    Professor
  • Topic TBC

Foundry/IC Design Update

09:35 – 09:55

Session Keynote: UNISOC

  • Speaker TBC
  • Topic TBC
Dr. Wei Li photo
10:00 – 10:20

Zing Semiconductor

  • Dr. Wei Li
    EVP of National Silicon Industry Group / Chairman of Zing Semiconductor Corporation & SIMGUI Technology
  • Topic: The Breakthroughs of 300mm silicon wafer in China
10:25 – 11:25

Networking, Coffee, Tea Break, Business Meeting 1 & 2

Donghui Lu photo
11:30 – 11:50

Intel Corporation

  • Dr. Donghui Lu
    VP, Co-GM of HVM Program Office
  • Topic TBC
11:55 – 12:15

Baidu

  • Speaker TBC
  • Topic TBC
Michael Wu photo
12:20 – 12:40

OmniVision Technologies

  • Michael Wu
    Senior Vice President, Global Sales and Marketing
  • Topic TBC
12:45 – 13:45

Networking Lunch

Advanced Packaging

Eric Hsiung photo
13:50 – 14:10

Amkor Technology, Inc.

  • Eric Hsiung
    VP, Greater China Sales & Marketing
  • Topic TBC
14:15 – 14:35

JCET Group

  • Dr Shengmin Wen
  • Topic TBC
Jingyang Zhang photo
14:40 – 15:00

MooreElite

  • Jingyang Zhang
    Chairman and CEO
  • SiP Design and ATE Platform on the Cloud
Dr. Key Chung photo
15:05 – 15:25

TongFu Microelectronics Co., Ltd

  • Dr. Key Chung
    Advanced Packaging CTO
  • Various Advanced Packaging Solutions and its Trends
15:25 – 16:25

Networking Coffee, Tea Break, Business Meeting 3 & 4

Alan Lin photo
16:30 – 16:50

SJ Semiconductor (JiangYin) Corporation

  • Alan Lin
    VP TD
  • SmartAiP(TM) for Ultra-Wideband 5G mm-Wave Commutation
Dr. Yun Zhang photo
16:55 – 17:00

Shinhao Materials LLC

  • Dr. Yun Zhang
    CEO
  • All Copper Is Not Created Equal
Dr. David Haynes photo
17:05 – 17:15

Lam Research

  • Dr. David Haynes
    Managing Director of Strategic Marketing in Lam’s Customer Support Business Group
  • Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems
Dr. Christian Ohde photo
17:20 – 17:35

Atotech Group

  • Dr. Christian Ohde
    Global Product Director for Semiconductor, Lead Frame and Connectors
  • Technology Pushes Limits – Next Generation ECD Cu and E’less Deposition
Michael Ehringer photo
17:40 – 17:50

Trumpf Huettinger

  • Michael Ehringer
    VP Sales, Service and Marketing
  • Accelerating Innovation Cycles for Process Power Supplies
Dr. Tianniu Chen photo
17:55 – 18:05

Merck Holding (China) Co., Ltd

  • Dr. Tianniu Chen
    Head of Semiconductor Solutions, Electronics Business
  • Enabling the Future of Semiconductors and Electronics in a Data-driven World.
Sherry Zhu photo
18:10 – 18:20

Thermo Fisher Scientific

  • Sherry Zhu
    Commercial Head MSD Semi Commercial, China
  • From Pathfinding to Yield Learning
18:25 – 18:30

Closing Remarks

18:45 – 20:30

Tsinghua 110th Anniversary / Award Gala Dinner

13 Oct 2021 (Day 2)

08:30 – 08:55

Registration

Power Semiconductor

Jerry Liu photo
09:00 – 09:20

SMEC

  • Jerry Liu
    EVP
  • Topic TBC
Hector Ng photo
09:25 – 09:45

onsemi

  • Hector Ng
    Field Application Director
  • Silicon Carbide Power Devices Enable Modern Power Applications
Norman Zhou photo
09:50 – 10:10

STMicroelectronics

  • Norman Zhou
    Technical Marketing Director
  • New Wide Bandgap Material Technology and Application Overview
10:15 – 11:15

Networking, Coffee, Tea Break, Business Meeting 5 & 6

Autonomous Driving

Dr. Karl Fuchs
11:20 – 12:00

Panel Discussion on Automotive

  • New Enablers Towards High Level Autonomous Driving
  • Moderator: Dr Karl Fuchs
    VP Innovation and Technology Center – Continental

Confirmed Panellists:

Weide Zhang photo
  • Weide Zhang
    Chief Architect
    FAW (Nanjing) Technology Development Co.,Ltd
Wei Wang photo
  • Wei Wang
    Asst President, Director, Operation, R&D
    Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
  • Gansha Wu
    CEO
    UISEE Technologies (Beijing) Ltd.
Wilmer Zhou photo
12:05 – 12:25

OMDIA

  • Wilmer Zhou
    Semiconductor Principal Consultant
  • Topic TBC
12:30 – 13:30

Networking Lunch

AI

Julien Lai photo
13:35 – 13:55

Nvidia

  • Julien Lai
    Senior Director, Engineering and Solutions
  • Topic TBC
Dr. Kevin Xu
14:00 – 14:20

ZTE Microelectronics

  • Dr. Ke Xu
    AI Chief Scientist, and Director of Engineering
  • AI and Hardware Accelerators
Dr. Xiaoxin Qiu
14:25 – 14:45

Axera

  • Dr. Xiaoxin Qiu
    CEO
  • A New Path for AI Vision Processing
14:50 – 15:50

Networking, Coffee, Tea Break, Business Meeting 7 & 8

Jizhang Shan photo
15:55 – 16:15

Black Sesame Technologies (Shanghai) Co., Ltd

  • Jizhang Shan
    Founder and CEO
  • High-performance AD chip Enabling Intelligent Transformation
Zhong Han photo
16:20 – 16:40

Onto Innovation Inc

  • Peter Han
    Sales Director of China Branch
  • 2D/3D Inspection Solution for Advanced Packaging and Specialty Semiconductor Market
Dr. Olaf Herzog photo
16:45 – 17:05

Infineon Technologies AG

  • Dr. Olaf Herzog
    SVP
  • Transforming Semiconductor Manufacturing Using Artificial Intelligence?
    (Authors: Olaf Herzog, Natalie Gentner, Yao Yang, Infineon Technologies AG)

RISC-V

Dr. Naveed Sherwani
17:10 – 17:50

Panel Discussion on RISC-V

  • Future of RISC-V: Bright or Still Murky?
  • Moderator: Dr. Naveed Sherwani
    Chairman of OSFPGA Foundation and Chairman & CEO of Rapid Silicon

Confirmed Panellists:

Frankwell Lin photo
  • Frankwell Lin
    Co-Founder, Chairman and CEO
    Andes Technology Corporation
Dr. Eric Li photo
  • Dr. Eric Li
    Managing Partner
    Chengwei Capital
Thomas Xu photo
  • Thomas Xu
    CEO
    StarFive Technology Co., Ltd.
17:55 – 18:00

Closing Remarks